化學(xué)配方數(shù)據(jù)庫(kù)
| 配方類(lèi)型： |
ADHESIVES |
| 配方說(shuō)明： |
Binders for High Melting Masses |
| 配方組成： |
Bond Clay/10-20
Formula No.5 (Quartz
a) Corundum (4-5 mm grain size)/75-80
Bond Clay/10-15
"Aluphos" (approx. 5% of bond clay may be replaced by calcined "Giulini"
alumina CT 38)/5-10
b) Corundum (4-5 mm grain size)/80
Bond Clay/20
"Aluphos" (relative to the quantity of the two above components)(approx. 5%
of bond clay may be replaced by calcined "Giulini" alumina CT 38)/5-10/10
c) Corundum (0-4 mm grain size)/90
Bond Clay/10
"Aluphos" (relative to |
| 配制方法： |
In order to use "Aluphos" successfully, the addition of 5-10% bond clay to the refractory mass, and a suitable granulometry are necessary.
In addition, the molded parts have to be of an adequate density which can be obtained by either ramming or pressing. Molding by means of |
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